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2STC4467
High power NPN epitaxial planar bipolar transistor
Features

High breakdown voltage VCEO = 120 V Complementary to 2STA1694 Fast-switching speed Typical ft = 20 MHz Fully characterized at 125 oC
3 2 1
Applications
Audio power amplifier
TO-3P
Description
The device is a NPN transistor manufactured using new BiT-LA (Bipolar transistor for linear amplifier) technology. The resulting transistor shows good gain linearity behaviour. Figure 1. Internal schematic diagram
Table 1.
Device summary
Marking 2STC4467 Package TO-3P Packaging Tube
Order code 2STC4467
April 2008
Rev 2
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www.st.com 7
Electrical ratings
2STC4467
1
Table 2.
Symbol VCBO VCEO VEBO IC ICM PTOT Tstg TJ
Electrical ratings
Absolute maximum rating
Parameter Collector-base voltage (IE = 0) Collector-emitter voltage (IB = 0) Emitter-base voltage (IC = 0) Collector current Collector peak current (tP < 5 ms) Total dissipation at Tc = 25 C Storage temperature Max. operating junction temperature Value 120 120 6 8 16 80 -65 to 150 150 Unit V V V A A W C C
Table 3.
Symbol Rthj-case
Thermal data
Parameter Thermal resistance junction-case ______________ __max Value 1.563 Unit C/W
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2STC4467
Electrical characteristics
2
Electrical characteristics
(Tcase = 25 C; unless otherwise specified)
Table 4.
Symbol ICBO IEBO
Electrical characteristics
Parameter Collector cut-off current (IE = 0) Emitter cut-off current (IC = 0) Test conditions VCB = 120 V VEB = 6 V IC = 50 mA IC = 100 A 120 120 6 IB = 300 mA V CE = 4 V V CE = 12 V 70 20 1.5 140 MHz Min. Typ. Max. 10 10 Unit A A V V V V
Collector-emitter breakdown V(BR)CEO(1) voltage (I = 0) B V(BR)CBO Collector-base breakdown voltage (IE = 0)
Emitter-base breakdown voltage IE = 1 mA V(BR)EBO(1) (I = 0) C VCE(sat) (1) hFE fT Collector-emitter saturation voltage DC current gain Transition frequency IC = 3 A IC = 3 A IC = 0.5 A
1. Pulsed duration = 300 s, duty cycle 1.5%
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Package mechanical data
2STC4467
3
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com
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2STC4467
Package mechanical data
TO-3P Mechanical data
DIM. A A1 A2 b b1 b2 c D D1 E E1 E2 e L L1 L2 P Q Q1 MIN. 4.6 1.45 1.20 0.80 1.80 2.80 0.55 19.70 15.40 13.60 9.60 5.45 20 3.50 18.40 5 3.80 mm. TYP 1.50 1.40 1 MAX. 5 1.65 1.60 1.20 2.20 3.20 0.75 20.10 15.80
0.60 19.90 13.90
5.15 19.50 18.20 3.10
5.75 20.50 18.60 3.30
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Revision history
2STC4467
4
Revision history
Table 5.
Date 22-Nov-2007 30-Apr-2008
Document revision history
Revision 1 2 Initial release Document status promoted from preliminary data to datasheet. Changes
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2STC4467
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